Megapoxy E

When critical electrical and electronic components demand robust protection, Megapoxy E delivers. It's the high-impact epoxy system engineered for precise encapsulation and casting, ensuring components like instrument transformers and coils withstand stress and maintain integrity. The result is reliable electrical and dielectric performance, even under challenging temperature conditions.

Why this product exists

Megapoxy E was formulated to meet the rigorous demands of electrical and electronic industries. It provides reliable encapsulation and casting for sensitive components that require superior electrical insulation, dielectric properties, and mechanical strength. Its two hardener options allow it to perform consistently across a range of operating temperatures, from ambient to significantly elevated.

The numbers that matter

For applications where electrical integrity is paramount, Megapoxy E delivers a dielectric strength of up to 19 KV/mm. This ensures components are protected against electrical breakdown. Its ultimate compressive strength reaches 100 MPa, combined with a bond strength of 20 MPa, providing structural resilience against impact and mechanical stress. The choice between Hardener E and Hardener 155 extends service temperature capabilities up to 150°C, meaning the encapsulated components maintain performance under high thermal loads.

What it's like to use

Megapoxy E requires precise mixing ratios for optimal performance, specified by both weight and volume. Hardener E provides a 60-minute working time at 25°C, while Hardener 155 shortens this to 30 minutes, allowing for faster turnaround when needed. Both systems achieve minimum cure within 24 hours at 25°C. For best adhesion, surfaces must be pre-treated by cleaning with acetone or isopropyl alcohol; wire brushing is insufficient. Clean mixing implements and tools with Megapoxy Thinners immediately after use.

Where this product excels

• Electrical Component Encapsulation: Ideal for potting instrument transformers, lighting transformers, and small power transformers, ensuring reliable electrical insulation and protection.
• Coil and Solenoid Casting: Provides high impact resistance and mechanical support for coils and other magnetic components against vibration and physical impacts.
• Electrical Switchgear Casting: Forms robust, long-term castings for switchgear components, maintaining structural and electrical integrity.
• High-Temperature Assemblies: When paired with Hardener 155, it ensures continued performance in elevated temperature electrical assemblies up to 150°C.

Choose this when

• When you need to encapsulate or cast electrical and electronic components that require high dielectric strength.
• When components demand superior mechanical protection against impact and vibration.
• When the application requires sustained performance at elevated operating temperatures, up to 150°C.
• When precise, high-strength bonding and casting for electrical assemblies are critical.

Don't use this when

• Not for: Crack injection resin. For concrete crack injection, consider Megapoxy H.
• Not for: General epoxy surface sealing. Megapoxy PF is designed for these applications.
• Not for: Non-critical, general-purpose bonding or repairs where its specialized electrical properties are not required.
• Not for: Structural load-bearing applications unless specifically engineered and verified for that purpose.

Megapoxy E vs. Other Megapoxy Epoxies

Megapoxy E is a specialised, high-performance epoxy system explicitly designed for the rigorous demands of electrical and electronic component encapsulation and casting. This sets it apart from general-purpose epoxies like Megapoxy 34, Megapoxy 36, or Megabond, which may excel in broader structural bonding or repair tasks. Megapoxy E's formulation prioritises electrical insulation, dielectric properties, and mechanical strength, specifically catering to critical electrical assemblies and elevated temperature service that other epoxies may not be formulated to handle.

Related products

• Megapoxy Megabond